Tetsu Tanaka : rechercher sur Z-Library

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1

Intramolecular hydrosilation of acetylenes: Regioselective functionalization of homopropargyl alcohols

Kohei Tamao, Kimio Maeda, Tetsu Tanaka, Yoshihiko Ito

Journal:

Tetrahedron Letters

Année:

1988

Langue:

english

Fichier:

PDF, 156 KB

english, 1988

2

Report on 640 Victims of the Tokyo Subway Sarin Attack

Tetsu Okumura, Nobukatsu Takasu, Shinichi Ishimatsu, Shou Miyanoki, Akihiro Mitsuhashi, Keisuke Kumada, Kazutoyo Tanaka, Shigeaki Hinohara

Journal:

Annals of Emergency Medicine

Année:

1996

Langue:

english

Fichier:

PDF, 601 KB

english, 1996

3

[IEEE 2011 IEEE Energy Conversion Congress and Exposition (ECCE) - Phoenix, AZ, USA (2011.09.17-2011.09.22)] 2011 IEEE Energy Conversion Congress and Exposition - Loss evaluation of an AC-AC direct converter with a new GaN HEMT SPICE model

Okamoto, Masayuki, Toyoda, Genki, Hiraki, Eiji, Tanaka, Toshihiko, Hashizume, Tamotsu, Kachi, Tetsu

Année:

2011

Langue:

english

Fichier:

PDF, 1.34 MB

english, 2011

4

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Impact of deep-via plasma etching process on transistor performance in 3D-IC with via-last backside TSV

Sugawara, Yohei, Hashiguchi, Hideto, Tanikawa, Seiya, Kino, Hisashi, Lee, Kang-Wook, Fukusima, Takafumi, Koyanagi, Mitsumasa, Tanaka, Tetsu

Année:

2015

Langue:

english

Fichier:

PDF, 1.12 MB

english, 2015

5

Heterogeneous 3-D Integration Using Self-Assembly and Electrostatic Bonding

Koyanagi, Mitsumasa, Fukushima, Takafumi, Lee, Kang-Wook, Tanaka, Tetsu

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2016

Langue:

english

Fichier:

PDF, 3.43 MB

english, 2016

6

Impacts of land use changes from the Hanoi Master Plan 2030 on urban heat islands: Part 1. Cooling effects of proposed green strategies

Kubota, Tetsu, Lee, Han Soo, Trihamdani, Andhang Rakhmat, Phuong, Tran Thi Thu, Tanaka, Takahiro, Matsuo, Kaoru

Journal:

Sustainable Cities and Society

Année:

2017

Langue:

english

Fichier:

PDF, 7.37 MB

english, 2017

7

Tunnel field-effect transistor charge-trapping memory with steep subthreshold slope and large memory window

Kino, Hisashi, Fukushima, Takafumi, Tanaka, Tetsu

Journal:

Japanese Journal of Applied Physics

Année:

2018

Langue:

english

Fichier:

PDF, 1.09 MB

english, 2018

8

Onâwafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for throughâsilicon via applications: Comparison to plasmaâenhanced chemical vapor deposition SiO 2

Fukushima, Takafumi, Murugesan, Mariappan, Bea, JiâCheol, Hashimoto, Hiroyuki, Kino, Hisashi, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Journal of Polymer Science

Année:

2020

Fichier:

PDF, 4.49 MB

2020

9

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - 7-Î¼m-thick NCF technology with low-height solder microbump bonding for 3D integration

Miwa, Yuki, Kumahara, Kousei, Lee, Sungho, Liang, Rui, Kino, Hisashi, Fukushima, Takafumi, Tanaka, Tetsu

Année:

2020

Fichier:

PDF, 1.11 MB

2020

10

Natural convective heat transfer from a vertical isothermal surface to a non-Newtonian Sutterby fluid

Fujii Tetsu, Miyatake Osamu, Fujii Motoo, Tanaka Hiroshi, Murakami Kentaro

Journal:

International Journal of Heat and Mass Transfer

Année:

1973

Langue:

english

Fichier:

PDF, 788 KB

english, 1973

11

Analytical surface potential expression for thin-film double-gate SOI MOSFETs

Kunihiro Suzuki, Tetsu Tanaka, Yoshiharu Tosaka, Hiroshi Horie, Yoshihiro Arimoto, Takashi Itoh

Journal:

Solid-State Electronics

Année:

1994

Langue:

english

Fichier:

PDF, 424 KB

english, 1994

12

Serum tri- and tetra-antennary N -glycan is a potential predictive biomarker for castration-resistant prostate cancer

Ishibashi, Yusuke, Tobisawa, Yuki, Hatakeyama, Shingo, Ohashi, Tetsu, Tanaka, Masakazu, Narita, Shintaro, Koie, Takuya, Habuchi, Tomonori, Nishimura, Shin-Ichiro, Ohyama, Chikara, Yoneyama, Tohru

Journal:

Année:

2014

Langue:

english

Fichier:

PDF, 425 KB

english, 2014

13

[IEEE 2012 IEEE International Reliability Physics Symposium (IRPS) - Anaheim, CA, USA (2012.04.15-2012.04.19)] 2012 IEEE International Reliability Physics Symposium (IRPS) - Thermomechanical reliability challenges induced by high density Cu TSVs and metal micro-joining for 3-D ICs

Lee, Kangwook, Fukushima, Takafumi, Tanaka, Tetsu, Koyanagi, Mitsumasa

Année:

2012

Langue:

english

Fichier:

PDF, 4.28 MB

english, 2012

14

Impacts of Cu Contamination on Device Reliabilities in 3-D IC Integration

Kang-Wook Lee,, Ji-Chel Bea,, Ohara, Yuki, Murugesan, Mariappan, Fukushima, Takafumi, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2014

Langue:

english

Fichier:

PDF, 2.26 MB

english, 2014

15

Thermal fluctuation for the time-dependent Ginzburg-Landau simulation

Ichitsubo, Tetsu, Tanaka, Katsushi

Journal:

Physical Review E

Année:

2001

Langue:

english

Fichier:

PDF, 69 KB

english, 2001

16

Kinetics of cubic to tetragonal transformation under external field by the time-dependent Ginzburg-Landau approach

Ichitsubo, Tetsu, Tanaka, Katsushi, Koiwa, Masahiro, Yamazaki, Yoshihiro

Journal:

Physical Review B

Année:

2000

Langue:

english

Fichier:

PDF, 409 KB

english, 2000

17

[IEEE 2010 IEEE Custom Integrated Circuits Conference -CICC 2010 - San Jose, CA, USA (2010.09.19-2010.09.22)] IEEE Custom Integrated Circuits Conference 2010 - Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding

Koyanagi, Mitsumasa, Fukushima, Takafumi, Tanaka, Tetsu

Année:

2010

Langue:

english

Fichier:

PDF, 666 KB

english, 2010

18

Micro/Nano-Structures and Hydrogen Absorption/Desorption Properties of Mg/Cu Super-Laminates

Tanaka, Koji, Kiyobayashi, Tetsu, Takeichi, Nobuhiko, Miyamura, Hiroshi, Kikuchi, Shiomi

Journal:

Materials Science Forum

Année:

2010

Langue:

english

Fichier:

PDF, 8.22 MB

english, 2010

19

[IEEE 2014 International 3D Systems Integration Conference (3DIC) - Kinsdale, Ireland (2014.12.1-2014.12.3)] 2014 International 3D Systems Integration Conference (3DIC) - Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias

Inoue, Fumihiro, Philipsen, Harold, van der Veen, Marleen H., Vandersmissen, Kevin, Van Huylenbroeck, Stefaan, Struyf, Herbert, Tanaka, Tetsu

Année:

2014

Langue:

english

Fichier:

PDF, 1.05 MB

english, 2014

20

Glycoblotting method allows for rapid and efficient glycome profiling of human Alzheimer’s disease brain, serum and cerebrospinal fluid towards potential biomarker discovery

Gizaw, Solomon T., Ohashi, Tetsu, Tanaka, Masakazu, Hinou, Hiroshi, Nishimura, Shin-Ichiro

Journal:

Biochimica et Biophysica Acta (BBA) - General Subjects

Année:

2016

Langue:

english

Fichier:

PDF, 1.29 MB

english, 2016

21

Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration

Ito, Yuka, Fukushima, Takafumi, Kino, Hisashi, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Journal of Microelectromechanical Systems

Année:

2016

Langue:

english

Fichier:

PDF, 2.10 MB

english, 2016

22

Prognostic significance of pathological response to preoperative chemoradiotherapy in patients with locally advanced rectal cancer

Tomono, Ayako, Yamashita, Kimihiro, Kanemitsu, Kiyonori, Sumi, Yasuo, Yamamoto, Masashi, Kanaji, Shingo, Imanishi, Tatsuya, Nakamura, Tetsu, Suzuki, Satoshi, Tanaka, Kenichi, Kakeji, Yoshihiro

Journal:

International Journal of Clinical Oncology

Année:

2016

Langue:

english

Fichier:

PDF, 512 KB

english, 2016

23

[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC

Kino, Hisashi, Hashiguchi, Hideto, Tanikawa, Seiya, Sugawara, Yohei, Ikegaya, Shunsuke, Fukushima, Takafumi, Koyanagi, Mitsumasa, Tanaka, Tetsu

Année:

2015

Langue:

english

Fichier:

PDF, 1.03 MB

english, 2015

24

Colorimetric Detection of an Airborne Remote Photocatalytic Reaction Using a Stratified Ag Nanoparticle Sheet

Degawa, Ryo, Wang, Pangpang, Tanaka, Daisuke, Park, Susie, Sakai, Nobuyuki, Tatsuma, Tetsu, Okamoto, Koichi, Tamada, Kaoru

Journal:

Année:

2016

Langue:

english

Fichier:

PDF, 2.95 MB

english, 2016

25

[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler

Kino, Hisashi, Fukushima, Takafumi, Tanaka, Tetsu

Année:

2016

Langue:

english

Fichier:

PDF, 980 KB

english, 2016

26

[IEEE 2017 IEEE International Interconnect Technology Conference (IITC) - HsinChu, Taiwan (2017.5.16-2017.5.18)] 2017 IEEE International Interconnect Technology Conference (IITC) - Minimized hysteresis and low parasitic capacitance TSV with PBO (polybenzoxazole) liner to achieve ultra-high-speed data transmission

Kino, Hisashi, Tashiro, Masataka, Sugawara, Yohei, Tanikawa, Seiya, Fukushima, Takafumi, Tanaka, Tetsu

Année:

2017

Langue:

english

Fichier:

PDF, 659 KB

english, 2017

27

A remark on modified Morrey spaces on metric measure spaces

SAWANO, Yoshihiro, SHIMOMURA, Tetsu, TANAKA}, Hitoshi

Journal:

Hokkaido Mathematical Journal

Année:

2018

Langue:

english

Fichier:

PDF, 381 KB

english, 2018

28

[IMPERIAL COLLEGE PRESS Proceedings of the Final Symposium of the Tohoku University 21st Century Center of Excellence Program - Sendai International Center, Japan (7 – 9 January 2007)] Future Medical Engineering Based on Bionanotechnology - BIOLOGICALLY INSPIRED VISION CHIP FABRICATED USING 3-DIMENSIONAL INTEGRATION TECHNOLOGY

KURINO, HIROYUKI, NAKAGAWA, YOSHIHIRO, NAKAMURA, TOMONORI, YAMADA, YUSUKE, LEE, KANG-WOOK, TANAKA, TETSU, KOYANAGI, MITSUMASA

Langue:

english

Fichier:

PDF, 693 KB

english

29

[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - New concept of TSV formation methodology using Directed Self-Assembly (DSA)

Fukushima, Takafumi, Murugesan, Mariappan, Ohsaki, Shin, Hashimoto, Hiroyuki, Bea, Jichoel, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Année:

2016

Langue:

english

Fichier:

PDF, 2.22 MB

english, 2016

30

[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology

Mariappan, Murugesan, Bea, JiChel, Fukushima, Takafumi, Motoyoshi, Makoto, Tanaka, Tetsu, Koyanagi, Mitsumasa

Année:

2016

Langue:

english

Fichier:

PDF, 534 KB

english, 2016

31

Butyrate-Producing Probiotics Reduce Nonalcoholic Fatty Liver Disease Progression in Rats: New Insight into the Probiotics for the Gut-Liver Axis

Endo, Hitoshi, Niioka, Maki, Kobayashi, Noriko, Tanaka, Mamoru, Watanabe, Tetsu, Zang, Mengwei

Journal:

Année:

2013

Langue:

english

Fichier:

PDF, 22.52 MB

english, 2013

32

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration

Fukushima, Takafumi, Konno, Takayuki, Iwata, Eiji, Kobayashi, Risato, Kojima, Toshiya, Murugesan, Mariappan, Bea, Ji-Chel, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Année:

2011

Langue:

english

Fichier:

PDF, 1.40 MB

english, 2011

33

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration

Fukushima, Takafumi, Hashiguchi, Hideto, Yonekura, Hiroshi, Kino, Hisashi, Murugesan, Mariappan, Bea, Ji-Chel, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Année:

2016

Langue:

english

Fichier:

PDF, 4.07 MB

english, 2016

34

SAE Technical Paper Series [SAE International SAE 2011 World Congress & Exhibition - (APR. 12, 2011)] SAE Technical Paper Series - Development of HMI and Telematics Systems for a Reliable and Attractive Electric Vehicle

Yoshizawa, Shoichi, Tanaka, Yoichiro, Ohyamaguchi, Masahiro, Kitazaki, Satoshi, Kuroda, Kouichi, Sato, Shinpei, Obata, Tetsu, Hirokawa, Yuumi, Iwasaki, Masayasu, Maruyama, Kenji

Année:

2011

Langue:

english

Fichier:

PDF, 7.31 MB

english, 2011

35

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Self-Assembly Technologies for FlexTrate™

Fukushima, Takafumi, Susumago, Yuki, Kino, Hisashi, Tanaka, Tetsu, Alam, Arsalan, Hanna, Amir, Iyer, Subramanian

Année:

2018

Fichier:

PDF, 1.32 MB

2018

36

Detrimental Effect of Chronic Hypertension on Leptomeningeal Collateral Flow in Acute Ischemic Stroke

Fujita, Kyohei, Tanaka, Kanta, Yamagami, Hiroshi, Ide, Toshihiro, Ishiyama, Hiroyuki, Sonoda, Kazutaka, Satow, Tetsu, Takahashi, Jun C., Ihara, Masafumi, Koga, Masatoshi, Yokota, Takanori, Toyoda, Kaz

Journal:

Année:

2019

Langue:

english

Fichier:

PDF, 376 KB

english, 2019

37

[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application

Susumago, Yuki, Jacquemond, Achille, Takahashi, Noriyuki, Kino, Hisashi, Tanaka, Tetsu, Fukushima, Takafumi

Année:

2019

Langue:

english

Fichier:

PDF, 2.06 MB

english, 2019

38

[IEEE 2019 Electron Devices Technology and Manufacturing Conference (EDTM) - Singapore, Singapore (2019.3.12-2019.3.15)] 2019 Electron Devices Technology and Manufacturing Conference (EDTM) - Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV

Kino, Hisashi, Fukushima, Takafumi, Tanaka, Tetsu

Année:

2019

Langue:

english

Fichier:

PDF, 467 KB

english, 2019

39

[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration

Lee, Sungho, Liang, Rui, Miwa, Yuki, Kino, Hisashi, Fukushima, Takafumi, Tanaka, Tetsu

Année:

2019

Langue:

english

Fichier:

PDF, 736 KB

english, 2019

40

Targeted DNA demethylation of the Fgf21 promoter by CRISPR/dCas9-mediated epigenome editing

Hanzawa, Nozomi, Hashimoto, Koshi, Yuan, Xunmei, Kawahori, Kenichi, Tsujimoto, Kazutaka, Hamaguchi, Miho, Tanaka, Toshiya, Nagaoka, Yuya, Nishina, Hiroshi, Morita, Sumiyo, Hatada, Izuho, Yamada, Tetsu

Journal:

Scientific Reports

Année:

2020

Langue:

english

Fichier:

PDF, 2.41 MB

english, 2020

41

[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs

Miwa, Yuki, Lee, Sungho, Liang, Rui, Kumahara, Kousei, Kino, Hisashi, Fukushima, Takafumi, Tanaka, Tetsu

Année:

2019

Fichier:

PDF, 855 KB

2019

42

Significant Die-Shift Reduction and Î¼LED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics

Fukushima, Takafumi, Susumago, Yuki, Qian, Zhengyang, Shima, Chidai, Du, Bang, Takahashi, Noriyuki, Nagata, Shuta, Odashima, Tomo, Kino, Hisashi, Tanaka, Tetsu

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2020

Fichier:

PDF, 1.59 MB

2020

43

Seroepidemiological study of human herpesvirus-6 and -7 in children of different ages and detection of these two viruses in throat swabs by polymerase chain reaction

Tanaka-Taya, Keiko, Kondo, Toshio, Mukai, Tetsu, Miyoshi, Hiroko, Yamamoto, Yoshiko, Okada, Shintaro, Yamanishi, Koichi

Journal:

Journal of Medical Virology

Année:

1996

Langue:

english

Fichier:

PDF, 720 KB

english, 1996

44

Distribution and Ultrastructure of Afferent Fibers in the Parietal Peritoneum of the Rat

Koichi Tanaka, Tetsu Hayakawa, Seishi Maeda, Sachi Kuwahara-Otani, Makoto Seki

Journal:

The Anatomical Record Advances in Integrative Anatomy and Evolutionary Biology

Année:

2011

Langue:

english

Fichier:

PDF, 570 KB

english, 2011

45

Direct synaptic contacts on the myenteric ganglia of the rat stomach from the dorsal motor nucleus of the vagus

Tetsu Hayakawa, Sachi Kuwahara, Seishi Maeda, Koichi Tanaka, Makoto Seki

Journal:

The Journal of Comparative Neurology

Année:

2006

Langue:

english

Fichier:

PDF, 3.09 MB

english, 2006

46

The roles of intrahepatic Vα14+ NK1.1+ T cells for liver injury induced by Salmonella infection in mice

Masatoshi Ishigami, Hitoshi Nishimura, Yoshikazu Naiki, Kentaro Yoshioka, Tetsu Kawano, Yujiro Tanaka, Masaru Taniguchi, Shinichi Kakumu, Yasunobu Yoshika

Journal:

Année:

1999

Langue:

english

Fichier:

PDF, 1.09 MB

english, 1999

47

DCP-LA stimulates AMPA receptor exocytosis through CaMKII activation due to PP-1 inhibition

Takeshi Kanno, Takahiro Yaguchi, Tetsu Nagata, Akito Tanaka, Tomoyuki Nishizaki

Journal:

Journal of Cellular Physiology

Année:

2009

Langue:

english

Fichier:

PDF, 273 KB

english, 2009

48

Indomethacin enhances learning and memory potential by interacting with CaMKII

Takeshi Kanno, Takahiro Yaguchi, Tetsu Nagata, Tadashi Shimizu, Akito Tanaka, Tomoyuki Nishizaki

Journal:

Journal of Cellular Physiology

Année:

2012

Langue:

english

Fichier:

PDF, 729 KB

english, 2012

49

Natural convective heat-transfer from a vertical surface of uniform heat flux to a non-newtonian sutterby fluid

Fujii Tetsu, Miyatake Osamu, Fujii Motoo, Tanaka Hiroshi, Murakami Kentaro

Journal:

International Journal of Heat and Mass Transfer

Année:

1974

Langue:

english

Fichier:

PDF, 461 KB

english, 1974

50

End-tidal CO2 and plasma lactate level: a comparison of their use as parameters for evaluating successful CPR

Shigehito Sato, Tetsu Kimura, Naomitsu Okubo, Toshihiro Naganuma, Makoto Tanaka

Journal:

Année:

1993

Langue:

english

Fichier:

PDF, 460 KB

english, 1993